Abstract
The possibility of using electrocontrolled glue (ER glue) for fixing radioelectronic industry items during their vibrotesting is discussed. The schemes are presented for fixing items of different materials and shapes to the electrodes of the basic surface of the fixing device. The impact of technological factors is demonstrated to enable us to obtain an increase in the specific fixing force sufficient for mounting the items in order to conduct experiments in the required range of vibro-accelerations
About this article
Received
September 28, 2009
Accepted
November 27, 2009
Published
December 31, 2009
Keywords
ER glue
vibrotesting
radioelectronic industry
Copyright © 2009 Vibroengineering
This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
